第19卷第4期 2011年4月
文章编号
1004-924X(2011)04-0754-08
光学精密工程
Optics and Precision Engineering
Vol.19No. 4
Apr.2011
面向聚合物微器件超声波精密封接的阵列微导能结构
罗怡，张黄苗2，孙屹博2，王晓东】
(1.辽宁省微纳米技术及系统重点实验室，辽宁大连116024；
2.大连理工大学精密与特种加工教育部重点实验室，辽宁大连116024）
摘要：为提高象合物超声波精密封接的可控性，预防高温度场下聚合物的熔融流延影响封接界面质量和精度，提出了阵列式微导能结构。以聚甲基丙烯酸甲酯(PMMA)微小管道的封接为实验对象，研究了阵列微导能结构的尺度对超声波封接过程的影响；采用热压成型工艺在被封接表面制作了5组不同高度的微结构。采用基于声波传递效率反馈的超声波精密封接方式，对超声波作用下聚合物界面的润湿行为进行了观察分析，讨论了结构尺度对超声波封接质量的影响。结果表明，随着微结构尺寸的增大，实现完全联接需要的超声波能量量递增的趋势。该种微导能结构有效控制了聚合物熔融流延，获得了均一的封接面，可实现高质量精密封接。
关键词：趣声波精密封接；MEMS：聚合物器件，导能结构：润湿
中图分类号：TB559
文献标识码：A
doi:10,3788/OPE,20111904.0754
Microenergydirectorarrayforultrasonic precisesealingofpolymerMEMSdevice
LUO Yi',ZHANG Miao-miao',SUN Yi-bo',WANG Xiao-dong
(1.Key Laboratory for Micro/Nano Technology and System of Liaoning Proince,DalianUniversityofTechnofogy,Dafiani6o24,China,
2.KeyLaboratory for Precision and Non-traditional Machining Technology of the MinistryofEducation,DalianUniuersityofTechnology,Dalian116024,China)
Abstract: In order to improve the efficiency of uitrasonic bonding process for a polymer Electro-Me-chanical System(MEMS) and to prevent the flow of polymer under a high temperature,a micro energy director array was proposed. Based on the experiment of PMMA micro-pipe sealing, the influence of micro energy director array on the process of ultrasonic sealing was studied. Five kinds of micro ener-gy directors with different heights were fabricated on the sealing surface by a hot embossing tech-nique. The method of ultrasonic precise sealing based on acoustic transfer efficiency feedback was used in the experiment to study the influence of the height of the micro-array structure on the quality of uf-trasonic sealing and to observe the wetting behavior of micro-array structure. Experimental results in-dicate that the ultrasonic energy to achieve complete connection increases with increasing the height of micro energy director array. The micro energy director can control the flow of the melting-polymer ef
收稿日期：2010-08-31；修订日期：2010-10-27
基金项目：国家自然科学基金面上项目（No.50775024；No.50975037）