JB/T 10501—2005
电力半导体器件用管壳瓷件
Ceramic parts of case for power semiconductor devices
2005-03-19 发布
2005-09-01 实施
目 次
前言......................................  111
1范围........................................1
2规范性引用文件...................................1
3型号和尺寸.....................................1
3.1型号......................................1
3.2尺寸......................................1
4技术要求......................................4
4.1材质.....................................4
4.2外观......................................4
4.3尺寸公差....................................4
4.4主要性能....................................4
5检验规则......................................4
5.1 逐批检验...................................4
5.2 周期检验...................................4
6标志、包装、运输、贮存...............................5
6.1标志.....................................5
6.2包装......................................5
6.3运输......................................5
6.4    贮存..................................  __5
图1瓷件型号.....................................1
图2凸台平板形管壳的瓷环...............................2
图3凹台平板形管壳的瓷环...............................3
图4三端螺诚管壳的瓷帽................................3
表1凸台平板形管壳的瓷环尺寸.............................2
表2凹台平板形管壳的瓷环尺寸.............................3
表3三端螺栓形管壳的瓷帽尺寸.............................4
表4 逐批检验.................................  4
表5周期检验.....................................5