第18卷第3期 2010年3月
文章编号1004-924X(2010)03-0552-06
光学精密工程
Optics and Precision Engineering
Vol.18No.3
Mar.2010
半导体激光器列阵的smile效应与封装技术
王祥鹏1,2，李再金1.2，刘云1，王立军1
（1.中国科学院长春光学精密机械与物理研究所激发态实验室，吉林长春130033；
2，中国科学院研究生院，北京100039)
摘要：为了减小半导体激光器列阵在封装过程中引人热应力而产生的smile效应，提高半导体激光器列阵光束质量，利用对半导体激光器列阵发光点成像放大的方法，准确测量了半导体激光器列阵的smile效应，测量误差为士0.1μm。由于 smile效应的准确测量能客观地比较减小smile效应的各种技术与方法，本文根据分析测量结果，提出了通过优化封装半导体激光器列阵焊接回流曲线的方法，使smile效应值控制在土0.5μm内。该方法减小了半导体激光器列阵的smile效应值，提高了激光器列阵光束质量，为下一步研制小芯径、高光束质量半导体激光器列阵光纤耦合模块提供了基础条件。关键调：半导体激光器列阵;smile效应；对装；焊接图流曲线
中图分类号：TN248.4
文献标识码：A
Smileeffectandpackagetechniquefordiodelaserarrays
WANG Xiang-peng2, LI Zai-jin-2, LIU Yun',WANG Li-jun
(1.Key Laboratory of Ercited State Processes, Changchun Institute of Optics,
FineMechanicsandPhysics,ChineseAcademyofSciences,Changchun130033,China; 2.GraduateUniversityof ChineseAcademy of Sciences,Beijing100039,China)
Abstract: To reduce the smile effect caused by the thermal stress and to improve the beam quality of laser diode arrays, a set of optical system is designed for measuring the smile effect. By using an im age amplification method, the smile effect of a laser diode array is accurately measured, and the meas-urement error is about o. 1 μm. The quantitative characterization of the smile effect is a key technol-ogy to compare objectively the different measuring methods for smile effect and to reduce or eliminate the smile effect. According to analysis of the measurement results,the diode laser array package tech nique about reflow soldering is optimized, and the smile effect has been controlled within ±o. 5 μm. As the smile effect values of the laser diode array is decreased and the beam quality of the laser diode array is improved significantly,the proposed method provides a technological fundation for develop ment of small fiber diameters and high beam quality diode lasers.
Key words: diode laser array; smile effect; package; reflow soldering curve
收稿日期：2009-03-23；修订日期：2009-10-22.
基金项目：中国科学院长春光学精密机械与物理研究所三期创新工程资助项目；吉林省与中科院院地合作资助项目
(No.2007SYHZ0030)；科技部国际合作资助项目（No.2006DFA12600）；吉林省省长基金资助项目