第25卷第1期 2017年2月
材料科学与工艺
MATERIALS SCIENCE & TECHNOLOGY
D01:10.11951/j.issn.1005-0299.20160350
Vol. 25No.1 Feb. 2017
热处理中电沉积Ni-Fe合金箔粘结过程与抑制方法
任鸿儒，高金涛，王哲，裴滨，郭占成（钢铁冶金新技术国家重点实验室（北京科技大学），北京100083）
摘要：Ni-Fe合金往往经过热处理才能发挥其最佳性能，但是由于电沉积法制备的Ni-Fe合金箔厚度很薄，在批量化热处理过程中极易产生粘结现象，严重影响产品质量.为了深入研究粘结机理以解决粘结间题，本文通过电子显微镜分析了合金箔粘结部位微观形貌；通过超高温激光共聚焦显微镜，原位在线研究了热处理过程中合金箔表面微观形貌演变，推测了其与表面粘结的联系；同时也对电泳MgO涂层抑制粘结的效果进行了研究.结果表明：电沉积Ni-Fe合金箔在 950~1000℃C开始发生粘结；在1000℃以上时，合金箔表面发生软化，不仅促进合金箔间的粘附结合，而且加剧了合金箔粘附界面的原子扩散，使得合金箔界面间共生晶粒生成和长大，最终导致粘结.在合金箔表面电泳涂覆MgO，可获得均
匀分布的MgO涂层，可以有效起到隔离合金箔的作用，从而达到抑制粘结的目的，关键词：电沉积Ni-Fe合金箔；热处理；粘结；氧化镁涂层；电泳
中图分类号：TG132.2
文献标志码：A文章编号：1005-0299（2017)01-0023-07
Researchonthe stickingprocess duringannealingandthe suppression
method of electrodeposited Ni-Fe alloy foil RENHongru，GAOJintao，WANGZhe，PEIBin，GUOZhancheng
( State Key Laboratory of Advanced Metallurgy( University of Science and Technology Beijing) , Beijing 100083, China
Abstract: NiFe alloys usually obtain the best performance via heat treatment. However, the thin thickness of Ni-Fe alloy foil prepared by electrodeposition cuases the sticking phenomenon during annealing, which seriously deteriorates the product quality. In order to solve the sticking problem, sticking mechanism was studied in details in this work. The sticking micromorphology was investigated by the Scanning Electron Microscope (SEM). The evolution of the surface micromorphology of the Ni-Fe alloy foil as well as its sticking phenomenon during annealing was in situ online investigated using an ultra-high temperature confocal laser microscope. The effect of MgO coatings applied to avoid sticking was also studied. The results indicated that the sticking phenomenon occurred at 950 ~ 1 000 C. The surface of alloy foil became softening and viscous over 1 000 ℃, which promoted the adhesion between the alloy foils, and enhanced the ability of atomic diffusion. Therefore, the symbiotic grains form and grow at the interface of the alloy foils, leading to sticking phenomenon. Coating MgO on the surface of the alloy foils through electrophoretic deposition can achieve the uniform distribution of the MgO coatings, effectively inhibiting sticking
Keywords : electrodeposited Fe-Ni alloy foil; annealing; sticking; MgO coatings; electrophoretic deposition
Ni-Fe合金箔是优良的软磁材料，在电子高科技产业中有着广泛的应用.随着电子元器件的轻量化发展，对该类材料的需求日益增加.金属箔
收稿日期：2016-10-14.
网络出版时间：2016-12-21
基金项目：国家自然科学基金资助项目（51234001）作者简介：任鸿儒（1986一），男，博士研究生；
郭占成（1963一），男，教投，博士生导师
通信作者：需数据ail：zcguo@ustb.edu.cn.
传统的制备方法主要是轧制法，但是该方法流程长、能耗高，金属箔厚度容易受限.而电沉积法是新兴的纳微晶金属箔！制备方法，由于具有可批量化生产、低投人、能耗低和产品厚度越薄成本越低等特点，越来越受到关注.该方法是以电镀技术为基础，采用旋转阴极辊，边沉积边剥离镀层[2]，实现了从金属电沉积镀层到金属材料的跨越，有着广泛的应用前景，