连接参数对Ti53311S高温钛合金
TLP连接接头性能的影响张志伟！
王厚勤？王文平1
(1北京控制工程研究所，北京100190）
(2哈尔滨工业大学先进焊接与连接国家重点实验室，哈尔滨150001）
文摘采用Cu作为中间层实现了Ti53311S合金的TLP连接，通过SEM、EDS方法分析了接头界面的微观组织，研究了接头界面微观组织及力学性能随TLP连接温度及保温时间的变化规律。结果表明：TLP连接接头的典型界面结构为Ti53311S/β-Ti/Ti、Cu(Sn）金属间化合物/β-Ti/Ti53311S。随着TLP连接温度的升高或保温时间的增加，焊缝宽度逐渐增加，Cu元素向母材侧的扩散程度更加充分，化合物相分解消失，接头室温抗拉强度先大幅升高后趋于稳定，连接工艺为980℃/20min时，接头抗拉强度达到最大值899MPa。
关键词Ti53311S，TLP连接，Cu，微观组织，力学性能
中图分类号：TG453+9
D0I:10.3969/j. issn.10072330.2015.01.016
EffectofBondingParametersontheProperties ofTLPBondingJointsofTi53311SAlloy
WANG Houqin?WANG Wenping
ZHANGZhiwei'
(1 Beijing Institute of Control Engineering, Beijing, 100190)
(2 State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology,Harbin 150001)
Abstract Ti53311S alloy was successfully joined by TLP bonding with Cu filler metal. The interfacial micro-structure was characterized by SEM and EDS. Effects of TLP bonding temperature and holding time on the joint micro-structure and mechanical properties were investigated in details. The results showed that the typical interfacial micro-structure was Ti53311S/βTi/Ti,Cu(Sn) intermetallic compound/β-Ti/Ti53311S. The mutual diffusion degree be-tween base metal and Cu interlayer increased with the rise of TLP bonding temperature and increase of holding time, which caused the increase of the joint width and reduction of compound in the joint. The degree of diffusion affected the strength of the bonding greatly. The tensile strength of joints increased at first gradually and then tended to be sta-ble at room temperature. The highest tensile strength, which was achieved at the bonding temperature of 980°C hold-ingfor20min,was899MPa.
Key wordsTi53311S, TLP bonding, Cu, Microstructure, Mechanical properties
0
引言
Ti53311S合金是一种近α型钛合金，在550℃以下具有较好的综合力学性能，包括较高的瞬时强度、良好的热稳定性、优异的抗蠕变性能等，已经应用于航天器姿态控制发动机的喷注器[1-3]。由于喷注器具有结构复杂、精度要求高等特点，Ti53311S合金的连接成为制造过程中的关键问题。TLP（Transient
收稿目期：2014-12-02
LiquidPhase）连接方法综合了钎焊和固态扩散连接两者的优点，既能在较低温度下实现冶金连接，又能获得优异性能尤其是优异高温力学性能的接头[4-9]，适用于喷注器中Ti53311S合金的连接。因此，本文选用Cu作为中间层，对Ti53311S合金的TLP连接展开研究，分析了TLP接头的典型界面微观组织，较系统研究了钎焊温度、保温时间对TLP接头界面结构
作者简介：张志伟，1982年出生，工程师，主要从事材料加工研究。E-mail；zhiweich@163.com
— 62 — 万方数据
宇航材料工艺http://www.yhclgy.com2015年第1期