机械工程材料
MATERIALS FOR MECHANICAL ENGINEERING
2014年12月第38卷第12期Vol.38No.12Dec.2014
表面镀镍SiCp/Al复合材料与可伐合金的真空钎焊
高增"王西涛”，牛济泰"，3
（1.河南理工大学材料科学与工程学院，焦作454003；2.长沙矿山研究院有限责任公司，长沙410000；
3.河南晶泰航空航天高新材料科技有限公司，焦作454003)
摘要：采用扫描电镜、材料试验机等研究了表面化学镀镍后增强相体积分数为55%的SiCp/ 6063AI复合材料与可伐合金真空针焊接头的显微组织、剪切断口形貌以及针焊保温时间对接头组织和性能的影响。结果表明：表面镀镍后的SiC,/6063Al复合材料能够实现与可伐合金的真空针焊，在550C下保温20min能得到剪切强度为100MPa的接头，其断裂性质为脆性断裂；钎料中的钛元素能够与复合材料中的SiC颗粒发生化学反应，达到针料与基体的冶金结合；焊缝组织致密，针料对可伐合金和镀镍复合材料的润湿性都良好。
关键词：铝基复合材料；可伐合金；真空针焊；显微组织；表面镀镍
中图分类号：TB331
文献标志码：A
文章编号：1000-3738(2014)12-0020-05
VacuumBrazingbetweenSiCp/AlCompositesafter
SurfaceNickelPlatingandKovarAlloy
GAO Zeng', WANG Xi-tao’, NIU Ji-tail.3
(1, School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China;
2. Changsha Mining Research Institute Co. , Ltd. , Changsha 410000, China;
3. Henan Jingtai Aerospace High-Novel Materials Technology Co. , Ltd. , Jiaozuo 454003, China)
Abstract : The microstructure and shearing fracture morphology of the vacuum brazed joint between the SiCp/ 6063Al composites with 55vol. % of SiC particles after nickel plating on their surface and Kovar alloys were studied by means of scanning electron microscopy and shearing testing. The effects of soaking time on the microstructure and property of the joint were also investigated. The results show that the SiC,/6063Al composites after surface nickel plating could be jointed together with Kovar alloys by means of vacuum brazing technique, The joint with shear strength of 100 MPa was achieved at the brazing temperature of 550 C and soaking time of 20 min, which showed typical brittle fracture. The element Ti from the brazing fller metal reacted with SiC particles in the SiC,/ 6063Al composites, resulting in a metallurgical bonding between the filler metal and base material. The microstructure of weld metal was quite compact since the brazing filler metal can wet the Kovar alloy and SiC,/ 6063Al composites after nickel plating very well.
Key words: aluminium matrix composite; Kovar alloy; vacuum brazing; microstructure; surface nickel plat-ing
引言 0
随着我国航空航天工业及信息产业的高速发收稿日期：2014-01-25；修订日期：2014-08-19
基金项目：科技部科技型中小型企业技术创新基金资助项目
（11C26214105167）
作者简介：高增（1983一）.男，土家族，湖南常德人，博士研究生。导师：牛济泰教授
· 20· 万方数据
展，在航空航天和军事领域用途广泛的微波电路、微电子器件、半导体集成电路向着集成度高、功率大质量小、体积小、性能强和可靠性高等方向发展[1-3]。可伐合金等传统电子封装材料由于密度大、导热性能较差等原因已不能满足航空航天等领域电子封装的需要{4)。碳化硅颗粒增强铝基（SiCp/ AI)复合材料(以下称复合材料)是近年来发展起来的一种金属基复合材料，具有密度小，比强度、比刚