内容简介
集成电路中的现代半导体器件（影印版 英文版）
作者：（美）胡正明 著
出版时间：2012年版
内容简介
《集成电路中的现代半导体器件（英文版）》主要介绍与集成电路相关的几种主流半导体器件的基本原理，包括PN结二极管、MOSFET器件和双极型晶体管（BJT），同时介绍了与这些半导体器件相关的集成工艺制造技术。《集成电路中的现代半导体器件（英文版）》作者是美国加州伯克利大学的终身教授、美国工程院院士、中国科学院外籍院士，多年从事半导体器件与集成电路领域的前沿性研究工作。《集成电路中的现代半导体器件（英文版）》内容简明扼要、重点突出，深度掌握适宜，讲解深入浅出，理论联系实际。《集成电路中的现代半导体器件（英文版）》可作为微电子及相关专业本科生教材，也可以作为微电子及相关领域工程技术人员的参考书。
目录
Preface
1 Electrons and Holes in Semiconductors
1.1 Silicon Crystal Structure
1.2 Bond Model of Electrons and Holes
1.3 Energy Band Model
1.4 Semiconductors, Insulators, and Conductors
1.5 Electrons and Holes
1.6 Density of States
1.7 Thermal Equilibrium and the Fermi Function
1.8 Electron and Hole Concentrations
1.9 General Theory ofnandp
1.10 Carrier Concentrations at Extremely High and LowTemperatures
1.11 Chapter Summary
PROBLEMS
REFERENCES
GENERAL REFERENCES
2 Motion and Recombination of Electrons and Holes
2.1 Thermal Motion
2.2 Drift
2.3 Diffusion Current
2.4 Relation Between the Energy Diagram and V,%
2.5 Einstein Relationship Between D and u
2.6 Electron-Hole Recombination
2.7 Thermal Generation
2.8 Quasi-Equilibrium and Quasi-Fermi Levels
2.9 Chapter Summary
PROBLEMS
REFERENCES
GENERAL REFERENCES
3 Device Fabrication Technology
3.1 Introduction to Device Fabrication
3.2 Oxidation of Silicon
3.3 Lithography
3.4 Pattern Transfer-Etching
3.5 Doping
3.6 Dopant Diffusion
3.7 Thin-Film Deposition
3.8 Interconnect-The Back-End Process
3.9 Testing, Assembly, and Qualification
3.10 Chapter Summary-A Device Fabrication Example
PROBLEMS
REFERENCES
GENERAL REFERENCES
4 PN and Metal-Semiconductor Junctions
Part 1 PN Junction
4.1 Building Blocks of the PN Junction Theory
4.2 * Depletion-Layer Model
4.3 Reverse-Biased PN Junction
4.4 Capacitance-Voltage Characteristics
4.5 Junction Breakdown
4.6 Carrier Injection Under Forward Bias——Quasi-EquilibriumBoundary Condition
4.7 Current Continuity Equation
4.8 Excess Carriers in Forward-Biased PN Junction
4.9 PN Diode IV Characteristics
4.10 Charge Storage
4.11 Small-Signal Model of the Diode
Part 2 Application to Optoelectronic Devices
4.12 Solar Cells
4.13 Light-Emitting Diodes and Solid-State Lighting
……
5 MOS Capacitor
6 MOS Transistor
7 MOSFETs in ICs-Scaling, Leakage, and Other Topics
8 Bipolar Transistor