GB/T 37963-2019
电子设备可靠性预计模型及数据手册
Handbook of reliability prediction model and data for electronic equipment (IEC TR 62380:2004, Reliability data handbook—Universal model for reliability prediction of electronics components»PCBs and equipment NEQ)
2019-08-30 发布
2019-12-01 实施
目 次
前言.........................................1
引言...........................................1
1范围..........................................1
2規范性引用文件.....................................1
3术语和定义、符号....................................1
3.1术语和定义....................................1
3.2符号.......................................2
4使用说明........................................3
4.1前提条件.....................................3
4.2影响因子.....................................4
4.3数据使用.....................................4
4.4可靠性預计的用途和目的 .............................5
5环境影响........................................5
5.1概述.......................................5
5.2环境类型定义...................................5
5.3 电应力条件...................................9
5.4任务剖面.....................................9
5.5任务剖面案例...................................9
6印制电路板和混合集成电路...............................11
6.1印制电路板...................................11
6.2混合集成电路..................................12
7集成电路.......................................14
7.1有效范围....................................14
7.2集成电路的结温估计...............................14
7.3失效率模型...................................17
8二极管、半导体闸流管、晶体管和光电綱合器.......................22
8.1计算二极管和晶体管的結温............................22
8.2低功率二极管..................................24
8.3功率二极管...................................26
8.4低功率晶体管..................................28
8.5功率晶体管...................................30
8-6光电耦合器...................................33
9光电器件.......................................35
9.1    慨述.....................................35
9.2    LED 模块.................................35
9-3激光二級管模块..................................37
9.4通信用光电二极管和接收模块............................39
9.5无源光学元器件..................................40
9.6其他光学元器件..................................41
10电容器和热敏电阻器（NTC） ........................... 41
10.1固定塑料、纸介、电介质电容器..........................41
10.2固定瓷介电容器——I类 ............................42
10.3固定瓷介电容器——II类 ...........................43
10.4 固体倒电解电容器...............................44
10.5非固体铝电解电容................................45
10.6铝电解电容器一固体电解质............................47
10.7铝电解电容器一聚合物电解质...........................47
10.8可变瓷介电容器.................................48
10.9带负温度影响系数（NTC）的热敏电阻器.....................49
11电阻器和电位器 ...................................50
11.1固定、低功率膜电阻器..............................50
11.2热模压碳质固定电阻器..............................51
11.3固定、大功率膜电阻器..............................52
11.4低功率线绕电阻器................................53
11.5大功率线绕电阻器................................54
11.6固定、低功率表贴电阻器和电阻阵列........................55
11.7非线绕金属陶夜电位器..............................56
12电感器和变氏器 ...................................58
13微波无源元器件、压电元器件和声表面波滤波器......................59
14继电器........................................60
14.1湿簧继电器...................................60
14.2干簧继电器...................................62
14.3机电继电器、热动继电器.............................64
14.4工业继电器、高压真空继电器和功率水银湿簧继电器.................66
15开关和键盘 .....................................68
16连接器........................................69
17 灯.........................................71
18保护器件.......................................71
19 电池........................................72
20电动机和风机.....................................73
附录A （资料性附录）基于质址保证措施的元器件失效率水平修正...............74
附录B （资料性附录）元器件计数預计法与通用失效率....................75
参考文献.........................................83