目录
1范围.......................................1
2规范性引用文件..................................1
3术语和定义....................................2
4电压标示和材料 .................................3
5导体.......................................4
6绝錄.......................................5
7屏蔽.......................................5
8三芯电缆的魏芯、内衬层和填充...........................5
9单芯和三芯电缆的金属层..............................6
10金属屏薮...................................6
11同心导体....................................7
12金属套.....................................7
13金JM铠装...................................7
14外护套.....................................9
15试製条件...................................10
16例行试毁...................................10
17抽样试验...................................11
18电气型式试難.................................14
19非电气型式试發 ...............................16
20安装后电气试验 ...............................19
21电境产品的补充条款 .............................20
附录A （规范性附录）确定护层尺寸的假设计算方法.................25
附录B （规范性附录）数值修约 .......................  29
附录C （规范性附录）半导电屏蔽电阻率测量方法...................30
附录D （規苑性附录）透水试验..........................32
附录E （规范性附录）HEPR绝缘硬度测定....................34
附录F〈資料性附录）具有纵包金属精复合护层电魏组件的试验.............36
附录G （规范性附录）电缆产品的补充条款.....................38